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Basic Electronics

on May 19, 2023

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Atoms

the smallest particle of an element that can exist in combination.

What is an atom? Definition and Structure

Difference Between Conductor, Semiconductor and Insulator c

Semiconductor: P-Type and N-Type, Intrinsic and Extrinsic. - YouTube

Silicon vs Germanium / Difference between Silicon (Si) and Germanium (Ge) - YouTube

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Analog Layout Topics Preview

Antenna effect: If long Metal interconnects is connected to the poly gate if the charged particles stored in the metal during fabrication is sufficient to break thin gate oxide, which will act as a Antenna and it will breakdown the gate oxide beneath the poly gate. Antenna Ratio =metal Area(am)/gate area(ag) Preventions: 1)metal jumper:- 2)diode insrtion 3)dummy mos device. Matching: To minimize the mismatch of the device parameters that is called matching (or) To minimize the PVT variation Interdigitation; Here current will reflected to the near by device in which the gate terminals of all the device is shorted with drain and gate of source device. Common centroid: It gives 100% gradients matching. Gradients: Device should have same environment, same size, orientation,supply, temperature and location. Latchup: It is a failure mechanism in which a low resistance

ANALOG LAYOUT INTERVIEW QUESTIONS 1

1) Why we Need matching? Types of matching techniques? Explain? 2) Why we Need resister matching? 3) Where do you place the Antenna diode and what is the reason for it? 4) What is shielding, types of shielding techniques and where it will use? 5) Why shielding net is always connected to gnd ? 6) Virtuoso L and Virtuoso XL tool techniques? 7) What is the virtuoso version you have used? 8) What is the difference between MOSFET and BJT? 9) why NMOS technology is preferred mor than PMOS technology? 10) Threshold voltage ? 11) What is ERC Checks and softcheck errors? 12) How to fix the std call height? 13) What is end cap and decap ? 14) CMOS fabrication? 15) CMOS Characteristic? 16) BJT fabrication? 17) Explain

ANALOG LAYOUT INTERVIEW TOPICS 3

TOPICS :- 1) CMOS Fabrication 2) MOSFET 3) BJT vs MOSFET 4) dry & wet etching 5) matching 6) Latch up 7) Antenna effect 8) shielding 9) em & ir 10) wpe 11) body effect 12) Vt & sti & lod 13) channal length modulation 14) substate noise 15) ESD 16) ASIC Flow Projects :- 17) OP-AMP 18) Standard cells 19) BGR 20) LDO 21) PLL 22) ADC & DAC 23) L vs XL 24) LVS in & out puts

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Basic Electronics

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